Shenzhen Fastprint Circuit Technology Co Ltd

Capabilities

Surface treatment: HASL, Gold plating, Immersion gold, Immersion tin, Immersion silver, Gold fingers (hard gold), OSP Account of layers: double-side to above 40 layers Min trace width: 3mil (0.076mm) Min trace space: 3mil (0.076mm) Min space between trace to pads, pads to pads: 3mil (0.076mm) Minimum drill hole diameter: 6mil (0.15mm) Min pads for vias: 12mil (0.40mm) Max aspect ratio: 1:20 Max PCB dimensions: 23 x 35 inches (584.2 x 889.0mm) PCB thickness: 8.27-275.8mil (0.21-7.0mm) Max copper weight: 6OZ Solder mask bridge between solder dam: 4mil (0.10mm) Minimum soldermask annular: 1.5mil (0.038mm) Min thickness of soldermask: 0.40mil (10um) Soldermask colors: green, yellow, black, blue, matte, transparence LPI solder mask and peelable soldermask Min height of Legend: 4mil (0.10mm) Min width of front: 25mil (0.635mm) Min plugged holes size: 0.15mm Max plugged holes size: 0.5mm Legend colors: white, yellow, black Data format: GERBER, PROTEL, PADS2000, Powerpcb, ODB++ Electric test: 100% E-test high voltage test Special material: HTG FR4, high frequency (Rogers, Teflon, ARLON, TYCONIC), halogen free, different material mixing laminating Other test: Impendence control, Resistor of hole test, Micro section, Ionic cleanliness test, Soldering capacity, Thermal shocking, Reliability test, etc. Special techniques: blind and buried vias (min holes size is 0.2mm), high layer with heavy copper Remark: the copper foil is 1OZ and 0.5OZ, If the copper foil is above 2OZ (including 2OZ), the above parameter will be changed.